PCB PROFESSIONAL MANUFACTRRER!
Moisture is the most common and most destructive factor for the PCB circuit board. Excessive moisture can greatly reduce the insulation resistance between the conductors, accelerate the high-speed decomposition, reduce the Q value, and corrode the conductor. We often see that the metal part of the PCB circuit board has been caused by the chemical reaction of the metal and copper with the water vapor and oxygen.
The stack of PCB consists of the power layer, the stratum and the signal layer. The signal layer, as its name implies, is the wiring layer of the signal line. The power layer and stratum are sometimes referred to as plane layers.
When designing PCB soldering plates in the design of PCB, it is necessary to design strictly according to the relevant requirements. Because in the process of SMT patch, the design of PCB pad is very important. The design of pad will directly affect the weldability, stability and heat transfer of components, which is related to the quality of patch processing. What is the design standard of PCB pad?